The problem will be the heat pipe arrangement, since the heat pipes (in the Ti´s they´re attached to the top titanium bezel) differ comparing the different Ti-incarnations. A 400/500 case could be insufficient for proper cooling of a 550 MHz G4. I also doubt that the mainboard design is 100% identical, therefore it might be that the plate of the heat pipe that has to be attached to the G4 die is in a slightly off-center location when the parts are assembled.