In looking at the pictures of the new Power Mac enclosure, and reading comments about it at places like macosrumors.com, it appears clear that this new enclosure is REALLY focused on some heavy-duty cooling.
From what I've read, the enclosure has additional cooling vents, space for a HUGE heatsink, and a high-power, variable speed fan. That's some serious chip cooling capacity, IMHO.
I'm not an engineer, but I was wondering if this enhanced cooling is a clue that maybe Apple is looking at a bigger speed boost than we have been anticipating. The G4 chip certainly generates some heat, but I didn't think that even the dual-processor machines would need this kind of protection.
What do the rest of you think? Is Apple going to spring a secret Power5-based chip on us? Is the G5 ready to go now? Or is this enclosure just overbuilt way early in anticipation of G5's sometime next year, like we've all been led to believe?
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